Program for Tuesday, September 24th: Talk View (2024)

(Keynote) Battery Diagnostics and Virtual Sensors in Ferrari

(Keynote) An approach to Electronic Platform Complexity: the System Integration in Lamborghini

Design-of-Experiments and ALT plan for reliability qualification of chip resistors based on mission profile of

Reliability Assurance in Foldable Displays: Design of Experiment-Based Testing Strategy for Market-Ready

New statistical analysis methodology to forecast the memory cell behavior before reliability test

Condition Monitoring for Detection of Humidity-Induced Failures in Control Electronics of Power

Reliability analysis of high power LEDs for automotive: impact of current and temperature

Aging modelling of Li-Ion Battery Systems based on accelerated tests

Development challenges of a one-sided GaN-based high-current density buck converter through multiphysics optimization for electric vehicle

Performance characterization of lithium-ion battery and ageing under constant stress conditions at low

SMART Protection Design of Automotive Power Distribution Systems with Temperature-Based Electronic Fuses: Mathematical Background, Design Guidelines and Drawbacks of Energy-Based

Degradation model for insulation characteristics of tantalum capacitors related to manufacturing parameters and

Research on The Degradation of Contact Resistance of Wire-Spring Contacts in Different Wear

Reliability Design of GaN Based High-frequency Inverter Optimization

Correlating time and voltage laws in BTI

Evidence of resistive switching in SiNx thin films for MEMS capacitors: the role of metal contacts

Recovery and Unrecovered Damage During Interrupted CVS in MFIS FE devices

HTRB effects on threshold instability of 4H-SiC PowerMOSFET with carrots defects

Thermal layout optimization of electrolytic capacitors considering degradation self-acceleration effect for reliability

Semi-supervised parameter estimation for Synthetic Aperture Focusing in Scanning Acoustic Microscopy for a 3D reconstruction of plastic molded electronic

Reliability detection and analysis of elliptical holes corresponding to defects in electrothermal

On the influence of the porosity and hom*ogeneity of sintered die-attach layers on the power cycling

Aging impact of the SiC Mosfet gate dielectric

Failure mode competition and long-term reliability in the isothermal aging of sintered Cu joints

Investigating the thermal degradation trends for thermal interface materials in the power converter

PBO Delamination and RDL Corrosion detection on WLCSP Package Products

Laser voltage probing and simulation of a flip-flop with undesired quasi-static switching

Multi-sensor Data Fusion for Prediction of Remaining Useful Life of IGBT Power Modules

Effect of Drain Field Plate design and 2DEG density on Dynamic-RON of 650V AlGaN/GaN HEMTs

Evolution analysis of mechanical behavior of through‑silicon via under thermal cycling load

Innovation in copper bond wire package immersion decapsulation technique for stressed SOIC products

Discoloration: A Case of Mistaken Identity Callout For Reliability Stressed Palladium Coated Copper (PCC) Wires After Mold Compound

Long-Term Positive and Negative Gate Bias Stress Tests on Parallel Connected SiC MOSFETs at -40°C and

Single Event Irradiation Damage Effect of SiC MOSFETs Based on Degradation of Forward Conduction

Stress comparison of several short-circuit types on SiC MOSFET packaging

The Drift in Threshold Voltage and On-Resistance of SiC MOSFETs Induced by AC Bias Temperature

The failure of CW high-power optical elements due to laser beams characteristics

Low-Voltage Schottky p-GaN HEMT Properties under Extreme Repetitive Short-Circuit Operation Conditions : 2DEG Pinch-off, Stability, Aging, Robustness and Failure-Modes

Preliminary SiC MOSFET Gate-Cracking Modeling under Short-Circuit Based on Rankine's Damage Energetic Approach Using a Wide Temperature-Range Elastoplastic 2D

Impact of drain-source leakage on the dynamic Ron of power HEMTs with p-GaN gate

Effect of gate oxide thickness on gate latent damage induced by heavy ion in SiC power MOSFETs

Physics informed Markov chains for remaining useful life prediction of wire bonds in power electronic

Remaining Useful Life Prediction of DC Contactor Based on LSTM

Comparison of the long-term dynamic Rds(ON) variation and dynamic high temperature operating life test robustness of Schottky gate and ohmic gate GaN HEMT with comparable stress

Study on intermittent fault mechanism of high-density integrated circuits under temperature shock

Growth of nanovoids in electroless Cu layer of Micro-via after Thermal Reliability Test

Creep tester for quality assessment of solder joints using normal and thermal stress

Heat-resistant durability of AMB substrates for SiC power devices: AlN and Si3N4, which one is thermally

Online Junction Temperature Monitoring of SiC MOSFET Based On The Maximum Drain Current Change Rate During The Process of

Efficient Long-term Reliability Assessment of Planar InGaAs/InP Avalanche Photodiodes using Accelerated Step-Stress

Active Gate Driver for Current Overshoot Suppression of SiC+Si Hybrid Switches with Dynamic gate Current

Optimized Semi-Physical EKV Model for Simulation of SiC MOSFETs

A study of UIS ruggedness of mismatched paralleled SiC MOSFETs

The Use of Filtered High-Energy X-rays and 60Co for TID Testing of a 32-Bit 28nm FDSOI DSP

Comprehensive LED Reliability Assessment through Integrated Real-Time Visualization, Electrical, and Optical

Machine learning classification for failure analysis of smart spark plugs

Issues of electronic devices in hostile environment

Methodology to estimate the impact of Single Event Transients in Logic

Lifetime prediction for power modules in wind-energy converters based on temperature variations in a large area substrate solder

On the Validity of Rainflow Counting-Based Lifetime Assessment for Power Electronics Assembly

Reliability Prediction of Electronic Components based on Physical of Failure with Manufacturing Parameters

Reliability prediction of multi-level power supply system based on failure precursor parameters

A New Methodology of Modeling Conducted Emission Behavioural in System-in-Packages (SiP)

Series AC Arc Fault Diagnosis Method Based on Spectrogram and Deep Residual Network

Condition Monitoring of a DC-Link Capacitor in an Inverter with a front-end diode rectifier under Imbalanced Three-phase Supply

Analysis and experimental verification of current sharing among parallel-connected dc-link capacitors in a fast-switching

Conducted EMI Assessment of Aging Power Si-MOSFET in 3 phase inverter

High AC load current testing method for power capacitors

Reliability and Failure Analysis of AlGaN/GaN HEMT with NiPtAu and PtAu Gate

Study of Trapping Mechanisms Affecting AlGaN/GaN HEMTs adopting AlGaN Back-Barriers with Different Aluminum

Nonlinear modelling of AlN/GaN HEMT accounting for Self-biasing effect during RF step stress: analysis and

DC and RF aging test of AlGaN/GaN HEMT technology on SiC substrate